Addsino Co., Ltd., a subsidiary of China Aerospace Science and Industry Corporation Limited (CASIC), came to a project investment cooperation agreement with the Management Committee of Chongqing Xiyong Comprehensive Bonded Zone on April 4.

The Aerospace New-generation Communications Co., Ltd., a project company of the New-generation Communication Technology Research Institute of CASIC, was inaugurated on the same day. The company is positioned as the pioneer for developing the next-generation communication technology industry, the main pillar of the industrial basic network platform, and the platform for capital aggregation and industry incubation of CASIC.

In line with major national strategies of the Belt and Road Initiative and the Yangtze River Economic Belt, the company will avail itself of Chongqing's vigorous implementation of the innovation-driven development action plan led by big data and smart technology.

Based on CASIC's industrial clusters of "intelligent industry" and "industrial Internet + intelligent manufacturing + 5G", the company will place its emphasis on the basic technologies and key products of "core network + bearer network + access network." It is poised to foster five bases for technology research, product research and development, industry development, talent training, innovation, and entrepreneurship. 

In this context, a technological innovation system and a communication industry cluster that integrate production, education, research, and practical application will come forth, making Chongqing a pacesetter in communication technology, industry, and talent in the country, and fueling the construction of the Western (Chongqing) Science City and the Chengdu-Chongqing economic circle.

To become a national demonstration base of new-generation communication technology and industry, the Aerospace New-generation Communications will attach weight to such core products as SDN switches, time-sensitive networking switches, microwave relay equipment, PTN-based backhaul, and IoT access gateways while expanding its presence in cutting-edge technologies like satellite interconnection and 6G.

Xiyong Micro-electronics Industrial Park has fostered a complete science and technology innovation ecosystem, which involves Intel FPGA China Innovation Center, Huawei Kunpeng Chongqing Center, the First Startup (Chongqing) Innovation Center, Bosch Industry 4.0 Innovation Technology Center, and SAP Intelligent Manufacturing Joint Innovation Center.

By leveraging the attraction of projects, convergence effects of industry, and environment superiority, a powerhouse for the microelectronics industry will emerge while more talented persons will come together. The Institute's establishment will boost the development of Xiyong Micro-electronics Industrial Park and further Chongqing's building of a nationally influential scientific and technological innovation center.