Chongqing- Gathering more than 70 Ph.D. scientists and launching an 8-inch pilot test platform for the fabrication of silicon optical integrated circuits with high-end technology in just one year and a half. One institution that can do this in a short time is the China United Microelectronics Center (CUMEC).
CUMEC is a state-level international integrated circuit research and development institution jointly established by China Electronics Technology Group Corporation and Chongqing Municipal Government. It was registered and established in October 2018 and officially settled in Chongqing Xiyong Micro-electronics Industrial Park.
China United Microelectronics Center (CUMEC) is located in Chongqing Xiyong Micro-electronics Industrial Park.
"In three to five years, CUMEC will build itself as an international first-class innovation platform in the photoelectric fusion high-tech field and become a leading innovative leader in the field. Also, it will provide the core support for China's new generation information infrastructure construction and the development of Chengdu-Chongqing Economic Circle." one related head of CUMEC told Chongqing.
An integrated microwave photonic chip designed by CUMEC.
As one technology director of CUMEC said, silicon-based optoelectronic technology is the future of the development of the information industry. With this in mind, CUMEC has devoted to improving our capacity for independent innovation. We have built a platform focus on high-end process research and development, such as silicon-based optoelectronics, heterogeneous 3d integration, germanium, and silicon radio frequency, based on the positioning of high-end process development and collaborative product design.
The center also established the first full-process silicon-based optoelectronic packaging test platform in China and realized the coupling packaging technology of high-density optical fiber and silicon optical chip.
The center also established the first full-process silicon-based optoelectronic packaging test platform.
"Now there is no unified standard about silicon-based optoelectronic chip packaging in the world. However, CUMEC firstly released the silicon-based optoelectronic chip packaging rules and has provided encapsulation testing services for the industrial chain of enterprises. It has promoted the silicon-based optoelectronic chip packaging technology standardization and solved a major technical problem for the mass production and industrialization of silicon-based optoelectronic chips." Dr. Feng Junbo, one backbone of CUMEC and the director of CUMEC silicon optical center, told reporters.
In addition, CUMEC also developed the domestic leading laser radar optical phased array antenna. It is expected to develop chip-level lidar in the next few years, which will widely be used in autonomous driving and robotics.
CUMEC started out with an "international vision." At present, CUMEC has gradually formed a development trend of collaborative innovation in Hong Kong, Macao, Singapore, Belgium and
Chongqing.
In less than three months, CUMEC completed the approval, registration, and core team-building of its wholly-owned subsidiary in Hong Kong. Through the establishment of its Hong Kong subsidiary, it will attract top scientific research talents from all over the world. Besides, it will promote the research and development of artificial intelligence chips and systems, the Internet of things chips, 5G chips, and other technologies and products.
At present, the Hong Kong subsidiary has gathered a team of 23 talents from Guangdong, Hong Kong, Macao and overseas, among whom 11 doctors have more than ten years of rich research and development experience in the industry.
In the future, the Hong Kong subsidiary will further take advantage of the "Guangdong-Hong Kong-Macao Greater Bay Area" policy, regional advantages, environmental advantages to attract top talent. Furthermore, it will focus on the research area, such as artificial intelligence chip architecture, application system and application, 5G application, and artificial intelligence design tools, to promote the development of Hong Kong subsidiaries in artificial intelligence chips and systems.
CUMEC takes the construction of the talent team as the most important work, insists that talent is the first resource for scientific and technological innovation.
CUMEC takes the construction of talent team as the most important work, insists that talent is the first resource for scientific and technological innovation, recruiting talents from all over the world, and cooperating with universities. It abroad expands channels to attract talents from home and abroad and built an innovative talent team with scale, innovative spirit, and the courage to take risks.
On August 27, 2019, CUMEC promoted and facilitated the close cooperation with the National University of Singapore, the Chinese University of Hong Kong and the University of Macau, and signed the memorandum of cooperation at the Smart China Expo 2019, focusing on promoting in-depth cooperation and diversified high-level personnel training in the field of integrated circuits.
In just one and a half years, CUMEC has gathered a backbone team of more than 200 talents with rich experience in integrated circuit technology, high-level research, and development talents, and capable and efficient management talents, including eight leading talents, nearly 70 Ph.D., and nearly 60 technical backbones with overseas study and work experience.
In the next five years, CUMEC will continue to introduce and gather global talents through diversified channels to form a talent echelon with entrepreneurs, management talents, project managers, and craft masters as the core. The plan is to form a high-level talent team of about 600 people by 2025, including 30 leading talents, more than 200 Ph.D., and 50% of the staff with overseas study and work experience.
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