File photo: Chongqing Xiyong Comprehensive Bonded Zone (Photo/Xinhua)

The Chongqing Xiyong Comprehensive Bonded Zone, situated in the Xiyong Microelectronics Industrial Park within the Chongqing High-tech Industrial Development Zone, was approved by the State Council in February 2010. Spanning a planned area of 7.58 square kilometers, it is the first comprehensive bonded zone in central and western China and serves as a key platform for Chongqing to build an inland open highland.

The zone has developed into the world's largest laptop manufacturing base and established a cluster for the development of intelligent terminal products, including printers, servers, smartphones, and wearable devices, along with their key components.

It also features a complete integrated circuit industry chain, encompassing chip design, manufacturing, packaging, and testing. At the same time, new trade formats such as cross-border e-commerce bonded cultural trade and bonded financial leasing are rapidly developing in the zone.

In 2021, Xiyong Comprehensive Bonded Zone achieved a total industrial output value of 236.1 billion yuan ($32.46 billion), a 15.8 percent increase. The total foreign trade import and export value was approximately 336.9 billion yuan, accounting for 42.1 percent of the city's total and growing by 15.5 percent. This ranked the zone fourth among comprehensive bonded zones nationwide and sixth among special customs supervision areas in China.

The zone features four major functions: customs clearance, bonded processing, bonded logistics, and service trade.

It supports a range of activities, including the storage of import and export goods and other goods pending customs clearance, international transit trade, international procurement, distribution and delivery, international transshipment, inspection and after-sales service, product display, research and development, processing, and manufacturing. It has become a key platform for Chongqing's opening up.

(Qi Xiaofang, as an intern, also contributed to this article.)