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AT&S Committed to Strengthening Chongqing's Global Industrial Position through Partnerships and Technology

By YUTING CHEN|Sep 28,2024

Chongqing – AT&S presented a key paper on Strategies and Measures for Building a Modern Manufacturing Cluster System at the 18th Meeting of the Chongqing Mayor's International Economic Advisory Council (CMIA), offering a comprehensive proposal for the city's development.

Zhu Jinping, Senior Vice President and chairman of the Board of Directors of AT&S China stated that integrating advanced technologies and promoting collaboration across the industrial value chain could enhance Chongqing's competitiveness. This ecosystem-driven model would boost technological advancements and support sustainable economic growth in the region.

In the proposal, AT&S drew upon the experiences of several European innovation clusters, offering a detailed analysis of the key steps required to overcome challenges and establish a robust, competitive, and sustainable ecosystem. 

With strategic planning, strong partnerships, and a steadfast commitment to innovation, Zhu affirmed that Chongqing is well-positioned to achieve its vision of becoming a global hub for intelligent manufacturing.

Reiterating AT&S's commitment to strengthening Chongqing's global industrial value chain position, Zhu highlighted three key pillars: partnerships, talent development, and cutting-edge technology. He emphasized that aligning these elements with Chongqing's strengths will accelerate the city's transformation into a global high-tech manufacturing hub.

Since 2011, Chongqing has been one of AT&S's key production bases. The company has consistently invested in high-tech innovations in the city, producing advanced semiconductor packaging substrates and modules for high-performance processors, computers, data centers, gaming consoles, 5G, automotive, and AI applications.

Since 2011, AT&S has been present in Chongqing. The location comprises three plants and manufactures state-of-the-art IC substrates and modules. (Photo/ AT&S)

AT&S, an Austria-based global leader in semiconductor packaging substrates and printed circuit boards, develops advanced interconnect technologies for mobile devices, automotive, aerospace, industrial, medical, VR, and AI sectors.

The company operates production sites in Austria, India, China, and South Korea and is building a high-end semiconductor substrate facility in Malaysia and a technology center in Austria, both of which are set to open in fiscal year 2024/25.


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